Feature
The sleeve offers stable thermal and electrical properties with good dimensional stability during processing. Its composition provides reliable mechanical strength, low dielectric loss, and consistent viscosity behaviour, making it suitable for precision sealing and insulation applications.
Application
It is used as a protective sleeve for diodes and similar electronic components. It supports stable sealing performance at elevated temperatures and maintains compatibility with semiconductor and metal materials in vacuum or high-temperature operating conditions.
Available Size
Parameter |
Value |
Outer Diameter |
1.0-5.0mm |
OEM is acceptable
Chemical Properties
Composition |
SiO2 |
PbO |
K2O |
B2O3 |
Al2O3 |
Other |
Weight (%) |
32 |
61 |
3.5 |
3.2 |
0.2 |
0.1 |
*For reference only
Physical Properties
Property |
Value |
Linear Expansion Coefficient (20~300℃) |
8.83×10-6/℃ |
Density |
4.48g/cm3 |
Softening Point |
562℃ |
Annealing Point |
428℃ |
Temperature for sealing diodes |
620℃ |
Working Point |
750℃ |
*For reference only