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Lead-Free Fuse Glass Tubing

This lead-free glass tubing is engineered for fuse assembly. It belongs to the SiO₂-B₂O₃-R₂O glass system with low alkali oxide content and high silica composition. This material achieves low linear thermal expansion coefficient, low dispersion, reliable chemical stability, excellent thermal stability and good electrical insulation performance.

    Feature

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    The glass adopts optimized formula and delivers outstanding physical and chemical properties with rigid texture, offering high hardness, pressure resistance and superior explosion-proof grade. Special anti-explosion processing minimizes breakage risk to ensure safer operation. The tubing maintains high dimensional precision with neatly cut ends, and end-sealed finished items can be provided. Custom sizes and multiple glass variants with different thermal expansion coefficients are available to satisfy different customer requirements.

    Application

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    This lead-free glass tubing serves as the outer housing for electronic fuses, widely used in circuit protection scenarios.

    Available Size

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    No. Outer Diameter (mm) Wall Thickness (mm) Length (mm)
    1 1.6 0.3 1500
    2 2.98 0.7 1500
    3 3.15 0.7 1500
    4 4.3 0.8 1500
    5 4.6 0.8 1500
    6 5.78 0.7 1500
    7 5.78 0.9 1500
    8 7.5 0.8 1500
    9 8.9 1.2 1500
    10 9.1 1.2 1500
    11 9.2 1.0 1500
    12 10 1.0 1500

    Minimum length for end-sealed products: 5 mm; non-end-sealed tubing can be supplied in any custom length.
    *For reference only
    OEM is acceptable

    Chemical Properties

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    Parameter Unit Grade Test Standard
    Dielectric Constant (20°C,6MHz) / - SJ/T11043-1996
    Loss Tangent (20°C,6MHz) / - SJ/T11043-1996
    Water Resistance Grade 1 GB/T 17129-2010
    Acid Resistance Grade 1 GB/T 17129-2010

    *For reference only

    OEM is acceptable

    Physical Properties

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    Parameter Unit Value Test Standard
    Thermal expansion coefficient (30~380°C) ×10⁻⁶/K 3.5 ~7.0 SJ/T11036-1996
    Strain Point Ts °C 540 SJ/T11039-1996
    Transformation Temperature Tg °C 560 SJ/T11039-1996
    Softening Point (η=10¹³·⁴ poise) °C 780 SJ/T11038-1996
    Working Temperature (η=10⁴ poise) °C 1060 SJ/T11040-1996
    Density g/cm³ 2.46 SJ/T11033-1996
    Elastic Modulus MPa 77 GB/T 37780-2019
    Thermal Stability °C ≥230 SJ/T11037-1996
    Volume Resistivity (350°C) MΩ·cm ≥250 SJ/T11042-1996

    *For reference only

    OEM is acceptable